JPH0415238U - - Google Patents

Info

Publication number
JPH0415238U
JPH0415238U JP1990054556U JP5455690U JPH0415238U JP H0415238 U JPH0415238 U JP H0415238U JP 1990054556 U JP1990054556 U JP 1990054556U JP 5455690 U JP5455690 U JP 5455690U JP H0415238 U JPH0415238 U JP H0415238U
Authority
JP
Japan
Prior art keywords
bonding
capillary
bonded
tip
swinging
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1990054556U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0810188Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990054556U priority Critical patent/JPH0810188Y2/ja
Publication of JPH0415238U publication Critical patent/JPH0415238U/ja
Application granted granted Critical
Publication of JPH0810188Y2 publication Critical patent/JPH0810188Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP1990054556U 1990-05-28 1990-05-28 ボンディング装置 Expired - Fee Related JPH0810188Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990054556U JPH0810188Y2 (ja) 1990-05-28 1990-05-28 ボンディング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990054556U JPH0810188Y2 (ja) 1990-05-28 1990-05-28 ボンディング装置

Publications (2)

Publication Number Publication Date
JPH0415238U true JPH0415238U (en]) 1992-02-06
JPH0810188Y2 JPH0810188Y2 (ja) 1996-03-27

Family

ID=31576723

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990054556U Expired - Fee Related JPH0810188Y2 (ja) 1990-05-28 1990-05-28 ボンディング装置

Country Status (1)

Country Link
JP (1) JPH0810188Y2 (en])

Also Published As

Publication number Publication date
JPH0810188Y2 (ja) 1996-03-27

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees